Ambersil Non-Silicone Release FG 400ml Ambersil Non-Silicone Release FG 400ml
Ambersil Non-Silicone Release FG is a NSF M1 & H1 registered, non-silicone mould release agent. Based on ‘edible’ vegetable oils...
Ambersil Non-Silicone Release FG is a NSF M1 & H1 registered, non-silicone mould release agent. Based on ‘edible’ vegetable oils and has been formulated for the release of many commonly used types of polymers in the food processing industry.
Provides a ‘wet’ non-silicone release film for the release of polymers utilised in injection moulding, vacuum forming and many other moulding and forming processes. Ideal for use in the production of food quality packaging. Will not build up in the mould and helps to improve surface finish, reduce rejects and increase production.
Features & Benefits
- NZ AsureQuality Approved
- MPI C81 Approved – mould release agent
- MPI C15 Approved – lubricant Incidental contact
- NSF H1&M1 registered – mould release agent
- Use on food packaging which is intended for direct food contact such as plastic containers and bottles
- Will not interfere with post moulding operations such as bonding and labelling
- Operational temperature to +170°C
Ambersil Non-Silicone Release FG is a NSF M1 & H1 registered, non-silicone mould release agent. Based on ‘edible’ vegetable oils and has been formulated for the release of many commonly used types of polymers in the food processing industry.
Provides a ‘wet’ non-silicone release film for the release of polymers utilised in injection moulding, vacuum forming and many other moulding and forming processes. Ideal for use in the production of food quality packaging. Will not build up in the mould and helps to improve surface finish, reduce rejects and increase production.
Features & Benefits
- NZ AsureQuality Approved
- MPI C81 Approved – mould release agent
- MPI C15 Approved – lubricant Incidental contact
- NSF H1&M1 registered – mould release agent
- Use on food packaging which is intended for direct food contact such as plastic containers and bottles
- Will not interfere with post moulding operations such as bonding and labelling
- Operational temperature to +170°C
